Haesung DS
해성디에스 · 195870
Information Technology Components · KOSPI
Market cap US$937.5M (₩1.3T)
Overview
Haesung DS makes the structural packaging materials, called substrates, that physically hold and connect semiconductor chips inside finished electronic devices.
It supplies two main substrate types: lead frames and package substrates, shipping the majority of its output to integrated device manufacturers (IDMs, companies that both design and make chips) and outsourced assembly and test firms concentrated in China and Southeast Asia. Listed on KOSPI, Korea's main stock exchange, the company earns roughly three-quarters of its revenue from lead frames, with the remainder from package substrates.
Summary is AI-generated and may contain errors · figures from DART filings
Financials
Source: DART · FY ending Dec · latest FY2025Revenue
- FY2023US$487.1M
- FY2024US$437M
- FY2025US$473.5M
Operating profit
- FY2023US$74.3M
- FY2024US$41.2M
- FY2025US$33.7M
Net income
- FY2023US$61.2M
- FY2024US$42.5M
- FY2025US$17.3M
Key ratios (FY2025)
Why it matters
The company highlights a proprietary PPF plating technology for lead frames and a particular focus on automotive-grade lead frames, which require especially stringent quality standards.
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