Early redemption of exchangeable bonds

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ITM Semiconductor / Early redemption of exchangeable bonds (incl. overseas EBs) after issuance / (2026.07.20) Early redemption of exchangeable bonds (incl. overseas EBs) after issuance

Early redemption of exchangeable bonds (including overseas exchangeable bonds) after issuance Exchangeable bonds (overseas exchangeable bonds), Series 5

1. Matters concerning the bonds acquired before maturity Type of bonds: unregistered, interest-bearing, unsecured, privately placed new-type exchangeable bonds Issue date: 2023-07-20 Issuance method: domestic issuance (private placement) Exchange price: 23,100 Maturity date: 2053-07-20 2. Bond acquisition amount (Currency unit) 23,169,100,875 KRW: South-Korean Won - Total face value (electronically registered) of bonds acquired (currency unit): 21,500,000,000 KRW: South-Korean Won - Base exchange rate: - - Acquisition date: 2026-07-20 3. Remaining face value (electronically registered) of bonds after acquisition (currency unit): 0 KRW: South-Korean Won 4. Reason for acquisition before maturity and future handling method - Reason for acquisition: issuer's exercise of early redemption (call option) right - Handling method: bond cancellation (electronic registration cancellation) 5. Source of acquisition funds: funds on hand and borrowings 6. Method of bond acquisition: over-the-counter purchase 7. Other matters for reference in investment decisions - The above "bond acquisition amount" includes interest accrued at the early-redemption interest rate added to the bond's face value. (Early-redemption interest rate: 2.5% per annum, compounded, calculated quarterly) - The "acquisition date" of the above bond acquisition amount is the payment date of the bond acquisition amount. - The above "total face value of bonds after acquisition" is the balance of these bonds excluding the portion acquired by the issuer. - The 930,735 exchange-target shares held in custody with the Korea Securities Depository at the time these exchangeable bonds were issued are scheduled to be returned to the Company. Related disclosures: 2023.07.18 Material event report (decision to issue exchangeable bonds) 2023.07.18 Material event report (decision to issue debt securities recognized as capital)