Exchangeable bond issuance decision (subsidiary)

What happened

Decision to Issue Exchangeable Bonds (Material Matter of Subsidiary) Report on material management matter of subsidiary Hana Materials Co., Ltd.

1. Type of bonds: Series 2, unregistered, non-interest-bearing, unsecured, privately placed exchangeable bonds 2. Total face (electronically registered) amount of bonds (KRW): 100,000,000,000 2-1. (Overseas issuance) Face (electronically registered) total amount (currency unit): Not applicable; reference exchange rate etc. -; issuance region -; overseas listing market name - 3. Purpose of financing: Facility funds (KRW) -; business acquisition funds (KRW) -; operating funds (KRW) 10,000,000,000; debt repayment funds (KRW) 90,000,000,000; funds to acquire securities of other companies (KRW) -; other funds (KRW) - 4. Interest rate of bonds: Coupon rate (%) 0.00; Maturity interest rate (%) 0.00 5. Bond maturity date: 2028-09-14 6. Interest payment method: The coupon rate of "these bonds" is 0.0%, with no separate interest payment date. 7. Principal repayment method: For bonds held until maturity, the entire principal (electronically registered amount) plus interest calculated by applying the bonds' guaranteed yield to maturity, compounded annually, over the period from issuance to the September 14, 2028 maturity date, amounting to 100.0% of the electronically registered amount, shall be repaid in a lump sum at maturity. If the maturity date is not a business day, repayment occurs on the following business day, with no interest calculated after the principal maturity date. 8. Bond issuance method: Domestic issuance (private placement) 9. Exchange details Exchange ratio (%): 100 Exchange price (KRW/share): 34,388 Method of determining exchange price: The higher of (1) the arithmetic average of the 1-month weighted average price, 1-week weighted average price, and most-recent-day weighted average price of the target shares, and (2) the most-recent-day weighted average price, each as of the business day before the board resolution date for issuance of these bonds, with a 10% premium added; amounts of less than one (1) KRW are rounded up. Shares subject to exchange: 2,907,991 registered common shares of "Hana Micron Co., Ltd." held by the issuing company Exchange request period: Start September 15, 2026 / End August 14, 2028 Exchange price adjustment: Standard anti-dilution adjustment provisions apply for capital increases below market price, bonus issues, stock dividends, stock splits, issuance of CBs/BWs below market price, or other share issuances before an exchange request (excluding employee stock options and shares issued on their exercise), using the formula based on pre-issuance share count, newly issued share count, issue price per share, and market price, with adjustment also required for mergers, splits, capital reductions, or share consolidations of the target company (adjustment effective on the event's effective date), and for in-kind dividends based on fair market value of the distributed property; no adjustment is made for retirement/disposal of treasury shares or other market-price fluctuations; adjustments apply cumulatively, with resulting amounts of less than one (1) KRW rounded up. 10. Subscription date: 2026-09-14 11. Payment date: 2026-09-14 12. Lead underwriter: - 13. Guarantee institution: - 14. Board resolution date (decision date): 2026-08-04 - Outside director attendance: Present (persons) 1 / Absent (persons) - - Auditor (audit committee member who is not an outside director) attendance: Present 15. Subject to securities registration statement submission: Not applicable 16. Reason for exemption from submission: Private placement (transfer unit split/consolidation prohibited for 1 year from issuance date) 17. Details of lending transactions linked to overseas issuance of these bonds: Not applicable 18. Subject to Fair Trade Commission reporting: Not applicable 19. Other important matters related to investment judgment - This matter concerns the decision to issue exchangeable bonds using, as the shares subject to exchange, the Company's registered common shares held by its subsidiary Hana Materials Co., Ltd. - The principal of the exchangeable bonds will be repaid in a lump sum at maturity; there is no early redemption request right (put option) for these bonds. - The above "14. Board resolution date (decision date)" is the board resolution date of Hana Materials Co., Ltd. - In "[Matters Concerning Subsidiary]" below, the "total assets of subsidiary (KRW)" and "total consolidated assets of parent company (KRW)" are as of the end of the most recent fiscal year (2025). ※ Related disclosures: -

[Details of bond issuance by specific subscriber] Subscriber name: Pipe Solution No. 5 Yuhan Hoesa (LLC) Relationship with company or largest shareholder: - Total face (electronically registered) amount issued (KRW): 100,000,000,000

[Specific purpose of use of raised funds] Operating funds and debt repayment funds

[Matters concerning subsidiary] Subsidiary name: Hana Materials Co., Ltd. (English: Hana Materials Inc.) Representative: Kim Hyun-ju Main business: Manufacture of other semiconductor devices Major subsidiary: Yes Total assets of subsidiary (KRW): 685,606,173,112 Total consolidated assets of parent company (KRW): 2,017,838,854,218 Ratio to total consolidated assets of parent company (%): 33.97